IndiesemiC Signs MoU with Kaynes Semicon to Advance Indigenous Semiconductor Packaging and Manufacturing in India
- IndiesemiC has signed an MoU with Kaynes Semicon to strengthen indigenous semiconductor packaging and manufacturing capabilities in India.
- The partnership aims to build a scalable pathway for semiconductor qualification, assembly, and testing within the country.
- The collaboration will initially focus on QFN40 and QFN64 packages for next-generation IoT, wearable, and display-led applications.
- The MoU aligns with India’s broader push towards semiconductor self-reliance and local value chain development.
- IndiesemiC plans to build 10 million units over the next three years for a global customer under this roadmap.
- An additional 5 million units annually are expected to be developed for other customers through the partnership
Ahmedabad / Sanand, March 31, 2026: IndiesemiC Private Limited, a fabless semiconductor and chip design company, has signed a Memorandum of Understanding (MoU) with Kaynes Semicon Private Limited, a leading Outsourced Semiconductor Assembly and Test (OSAT) facility based in Sanand, Gujarat. The partnership marks a strategic step towards strengthening India’s semiconductor ecosystem by bringing together chip design and backend manufacturing capabilities within the country. The collaboration is aimed at establishing a framework for the qualification, assembly, and testing of QFN40, QFN64, and other mutually agreed semiconductor packages for Indiesemic’s growing portfolio of ultra-low power and compact System-in-Package (SiP) modules and SoCs.
Commenting on the development, Nikul Shah, Founder & CTO, IndiesemiC, said, “This collaboration with Kaynes Semicon is an important step in strengthening the backend manufacturing readiness required to support India’s growing semiconductor ambitions. As a chip design company building solutions for next-generation electronics, it is critical for us to work closely with capable domestic partners who can support package development, qualification, and scalable execution.”
He further added, “The semiconductor industry is increasingly moving towards tighter integration between design, packaging, and deployment. In that context, partnerships like these are not just commercially relevant, but strategically important for India. They help create the ecosystem depth needed to move from isolated capabilities to a more complete and resilient semiconductor value chain. We believe this collaboration will support faster productisation, better alignment between innovation and manufacturing, and ultimately contribute to India’s long-term semiconductor self-reliance.”
The objective of this MoU is to create a scalable and reliable manufacturing pathway for Indiesemic’s semiconductor products, while leveraging Kaynes Semicon’s advanced OSAT infrastructure and packaging expertise. At a time when global supply chain disruptions and strategic technology dependencies are prompting companies to rethink manufacturing resilience, the partnership reflects a shared vision to support the growing demand for locally designed and locally supported semiconductor solutions. It also aligns with India’s broader push towards building a more integrated, self-reliant, and future-ready semiconductor value chain.
As part of the initial roadmap, the collaboration will focus on QFN40 and QFN64 packages, which are expected to support Indiesemic’s product roadmap across IoT, wearable, and display-led applications, while also laying the foundation for future package expansion. IndiesemiC plans to build 10 million units over the next three years for one of its global customers, along with an additional 5 million units annually for other customers. This planned scale reflects not only the commercial potential of the partnership but also the growing maturity of India’s semiconductor design ecosystem and the increasing need for domestic manufacturing readiness.
IndiesemiC has been steadily expanding its footprint in India’s semiconductor and embedded systems ecosystem through its focus on low-power, compact, and high-performance chip solutions tailored for emerging applications. The company has been working on System-in-Package (SiP) modules, SoCs, and integrated semiconductor architectures designed to address the evolving needs of sectors such as IoT, wearables, smart electronics, and embedded systems. With a strong emphasis on design innovation, performance, and local capability building, Indiesemic represents a new generation of Indian semiconductor companies contributing to the country’s technology and manufacturing ambitions.
The MoU between Indiesemic and Kaynes Semicon is more than a strategic business collaboration it reflects the broader momentum building within India’s semiconductor ecosystem. By bringing together design innovation and backend manufacturing capability, the partnership aims to create a stronger foundation for semiconductor product development, localisation, and scale. As India continues to strengthen its position in the global semiconductor landscape, such collaborations will play a defining role in shaping a resilient, innovation-led, and globally competitive semiconductor ecosystem.
About Indiesemic
Indiesemic Private Limited is an India-based semiconductor and chip design company focused on developing low-power, compact, and high-performance semiconductor solutions for next-generation applications across IoT, wearables, smart electronics, and embedded systems.
About Kaynes Semicon
Kaynes Semicon Private Limited is a semiconductor manufacturing company operating an OSAT facility in Sanand, Gujarat, with capabilities across a wide range of advanced semiconductor packaging technologies including QFN, DFN, BGA, FCBGA, discrete power packages, power modules, and co-packaged optics.
